Semiconductor Industry PS 8- Stainless Steel Detachable Control Cabinet

• Customization: Available
• Type: Standard Cabinet
• Usage: Network Integration System
• Model NO.: 1200*2000*600
• Installation: Vertical
• Fan Number: Four
• Capacity: 30U-40U
• Certification: ISO
• Condition: New
• Transport Package: European Pallet
• Specification: 1200*2000*600
• Trademark: Dayu
• Origin: China
• Production Capacity: 50000pieces

Product Description

Material Characteristics

1. Material Characteristics

 

• Chemical Composition and Microstructure: Stainless steel PS8 used in the semiconductor industry has a carefully formulated chemical composition, containing approximately 16% - 18% chromium and 10% - 12% nickel. Chromium forms a tough and self-healing chromium oxide protective film on the surface, which can effectively block various chemical corrosives encountered during the semiconductor manufacturing process, such as etching solutions, cleaning solvents, and high-purity chemicals. The nickel element endows stainless steel PS8 with excellent toughness and ductility, enabling it to withstand the mechanical stress and vibration generated during the operation of semiconductor equipment, and also reducing the brittleness of the material to prevent sudden fractures. From a microscopic perspective, its crystal structure is uniform and compact, which can enhance the strength and anti-fatigue performance of the material, allowing it to maintain stable physical and chemical properties in a long-term and complex working environment.
• Physical Property Indicators: It has excellent strength and hardness characteristics. The tensile strength is usually between 550 and 650 MPa, and the yield strength is approximately 250 - 300 MPa. Such strength enables it to bear the loads when components such as wafer transfer devices and reaction chambers in semiconductor equipment operate at high speeds and are subjected to complex forces, avoiding component deformation or damage. The Rockwell hardness (HRC) ranges from 28 to 32, with a moderate hardness that facilitates mechanical processing, such as precise cutting, drilling, and grinding operations. At the same time, it can maintain good wear resistance during frequent contact with semiconductor materials and other equipment components, preventing the decline in precision caused by wear. Its coefficient of thermal expansion is relatively low, approximately 16 - 18 × 10 / °C. When the semiconductor equipment generates heat during operation or the environmental temperature changes, it can effectively control the dimensional changes of components to ensure the precise fit of the equipment and its stable operation.

 

1. Processing Performance

 

• Cutting Processing Performance: It performs outstandingly in cutting processing. Due to its moderate hardness and stable internal structure, combined with appropriate tool materials (such as cemented carbide tools) and reasonable cutting parameters (the cutting speed is generally 100 - 150 m/min, the feed rate is 0.1 - 0.2 mm/r, and the cutting depth is 0.5 - 2 mm), high-precision processing can be achieved. For example, when processing shaft parts of semiconductor equipment, the surface roughness after processing can be controlled within Ra1.6 - 3.2 μm, and the dimensional accuracy can reach ±0.03 mm, fully meeting the strict precision processing requirements of the semiconductor industry for parts. Moreover, it has good chip-breaking performance. The chips generated during the cutting process have regular shapes and are easy to clean up, effectively reducing the occurrence of processing interruption and tool damage caused by chips winding around the tool, thereby improving processing efficiency and quality.
• Forming Processing Capability: It has excellent forming processing capabilities and can adapt well to both cold forming and hot forming. In cold forming operations, such as cold rolling and cold bending, its good ductility allows stainless steel PS8 sheets to be processed into various complex-shaped components of semiconductor equipment, such as equipment housings and guardrails. For example, through the cold rolling process, stainless steel PS8 sheets with a thickness of 2 - 5 mm can be processed into equipment side panels with specific arcs and shapes without cracks or fractures during the processing. In hot forming, after being heated to an appropriate temperature range of 950 - 1100 °C, the plasticity of the material is further enhanced, and it can be used for forging, hot rolling and other processing to manufacture key load-bearing components of large semiconductor equipment, such as the support structures of reaction chambers and the main frames of large wafer processing equipment. The internal structures of these formed components are uniform and the performance is reliable, which can meet the operation requirements of semiconductor equipment under high-precision and high-load working conditions.
• Welding Performance Characteristics: It has excellent welding performance and can adopt multiple welding methods, including manual arc welding, argon arc welding, and carbon dioxide gas shielded welding. During the welding process, due to its stable chemical composition and good fluidity of liquid metal, the weld seam has a beautiful shape and is not prone to welding defects such as pores, cracks, and slag inclusions. When welding, by selecting welding materials similar in chemical composition to the base metal (such as matching stainless steel welding wires) and reasonably controlling parameters such as welding current, voltage, and welding speed, the strength and corrosion resistance of the welded joint can be ensured to be equivalent to those of the base metal. For example, when using argon arc welding to weld stainless steel PS8 sheets with a thickness of 4 mm, the welding current is controlled between 100 and 130 A, the voltage is 12 - 16 V, and the welding speed is approximately 8 - 12 cm/min. The strength of the welded joint after welding can reach more than 95% of that of the base metal, and it has good corrosion resistance in the working environment of the semiconductor industry, which is crucial for ensuring the integrity and performance stability of the overall structure of semiconductor equipment and prolonging the service life of the equipment.

 

1. Application Components in Semiconductor Equipment

 

• Wafer Transfer Devices: Wafer transfer devices are key components in the semiconductor manufacturing process. The high strength, high wear resistance, and dimensional stability of stainless steel PS8 play an important role in them. During the wafer transfer process, the device needs to accurately transfer wafers from one process step to another and ensure that the wafers are not damaged. Stainless steel PS8 can withstand the stress generated by high-speed operation and frequent start-stop, and its good surface finish can reduce scratches on wafers, ensuring the integrity of wafers and the accuracy of the manufacturing process.
• Reaction Chambers and Their Accessories: Reaction chambers are the core places for chemical vapor deposition, etching and other processes in the semiconductor manufacturing process. Using stainless steel PS8 to manufacture reaction chambers and their accessories can provide good chemical stability and structural support. Reaction chambers need to withstand various high-temperature, high-pressure chemical corrosion environments. The corrosion resistance and high strength of stainless steel PS8 enable it to meet this requirement, preventing chamber leakage and damage and ensuring the safety and reliability of the process. Accessories such as chamber fixtures and support structures also require high precision and good mechanical properties. Stainless steel PS8 can ensure that these accessories maintain stable performance during long-term use, thereby improving the quality and efficiency of semiconductor manufacturing.
• Equipment Housings and Protective Structures: The housings and protective structures of semiconductor equipment made of stainless steel PS8 can, on the one hand, provide physical protection for the internal precision electronic components and mechanical parts, preventing external factors such as dust, moisture, and static electricity from interfering with and damaging the equipment. On the other hand, its metallic luster and the property that it can be subjected to surface treatments (such as painting, electroplating, etc.) make the equipment look more aesthetically pleasing, meeting the requirements of the semiconductor industry for the appearance of equipment to be clean and professional. Meanwhile, the corrosion resistance of stainless steel PS8 also ensures that the housings and protective structures maintain a good state in a complex working environment for a long time, reducing equipment maintenance costs.

Advantages

 

1. Excellent Corrosion Resistance

 

• The protective film formed by elements such as chromium and nickel in stainless steel PS8, combined with its stable chemical composition, enables it to exhibit excellent corrosion resistance in the environment full of corrosive chemicals in the semiconductor industry. High-purity chemicals such as etching solutions and cleaning solvents used in the semiconductor manufacturing process, as well as the possible humid environment, are hardly able to erode it. This characteristic greatly reduces the frequent maintenance and component replacement required due to equipment corrosion, reduces production costs, and at the same time ensures the long-term stable operation of semiconductor equipment and improves production efficiency. For example, in an advanced semiconductor manufacturing factory, the equipment made of stainless steel PS8 has a very low degree of corrosion after continuous operation for many years. Compared with equipment made of traditional materials, it significantly reduces the downtime and maintenance costs caused by corrosion.

 

1. Good Mechanical Properties

 

• The good balance of strength, hardness, toughness, and anti-fatigue performance is a significant advantage of stainless steel PS8. Under the working conditions of high-speed operation, frequent start-stop, and bearing various complex stresses of semiconductor equipment, it can work stably. Its high strength and hardness ensure that components will not be easily deformed or damaged when subjected to tensile, compressive, and frictional forces, while its good toughness and anti-fatigue performance enable it to cope with vibrations, impacts, and long-term cyclic stresses during the operation of the equipment, reducing the risk of equipment failure caused by sudden component fractures and improving the reliability and safety of semiconductor equipment and prolonging its service life.

 

1. Outstanding Processing Adaptability

 

• Whether it is cutting, forming, or welding processing, stainless steel PS8 can adapt well to the process requirements in the manufacturing process of semiconductor equipment. In cutting processing, it can achieve high-precision and good-surface-quality processing, providing a guarantee for the precision manufacturing of semiconductor equipment parts. Forming processing can manufacture various complex-shaped components to meet the diverse structural design needs of semiconductor equipment. The excellent welding performance facilitates the connection and assembly of components, ensuring that the quality of welded joints is equivalent to that of the base metal, improving the structural integrity and performance stability of semiconductor equipment as a whole, and reducing the process difficulty and cost in the manufacturing process.

 

1. Improvement of Semiconductor Product Quality

 

• Due to the application of stainless steel PS8 in semiconductor equipment, its good material characteristics contribute to the improvement of semiconductor product quality. For example, the high precision and stability of wafer transfer devices can ensure the integrity and positional accuracy of wafers during the transfer process, reducing manufacturing defects. The good performance of reaction chambers and their accessories can ensure the precision and stability of chemical processes, thereby improving the performance and yield of semiconductor chips. The effective protection of equipment housings and protective structures can reduce the interference of external factors on the chip manufacturing process, making semiconductor products more competitive in terms of quality and performance.